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Digital Grabbers |
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Model # |
Instruction |
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X64-CL-GigE LiteTM |
The X64-CL GigE Lite bundles X64 frame grabber technology into a standalone interface to create a powerful acquisition engine capable of capturing images from Camera Link cameras and transferring them over standard Gigabit Ethernet network links. |
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X64-CL-ExpressTM |
The X64-CL Express is a Camera Link frame grabber based on the PCI Express x1 interface – next generation bus interface technology for the host PCs. |
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X64-CL iProTM |
With the capability of simultaneous acquisition from two Camera Link cameras and FPGA based processing including Bayer decoding and shading correction the X64-CL iPro is ideal for cost sensitive/high performance applications |
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X64-CL DualTM |
One of the fastest and most flexible 64-bit image acquisition boards on the market with transfer images at a rate of up to 528MB/s. |
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X64-CL FullTM |
Compatible with one Base, Medium or Full Camera Link camera, the X64-CL Full is universal PCI slot compliant and supports all standard multiple tap area and line scan color and monochrome Camera Link cameras. |
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X64-LVDSTM |
The X64-LVDS is a high-performance image acquisition board for parallel output digital area and line scan cameras compatible with LVDS (EIA- 644) and RS422 standards. |
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PC2-CamlinkTM |
PC2-CamLink is ideal for cost-sensitive applications and compatible with one monochrome area or linescan Base Camera Link? camera. |
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Analog Grabbers |
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X64-AN Quad |
The X64-AN Quad is a high-performance PCI-X bus compatible frame grabber designed to deliver concurrent image acquisition from multiple independent standard and progressive scan analog camera. |
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PC2-Vision |
The PC2-Vision is a high-performance, PCI image acquisition board developed for cost-sensitive machine vision applications. |
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DALSA offers the widest range of high-performance CCD and CMOS cameras in the world. What sets our products apart are their unmatched combinations of speed, responsivity, and dynamic range, giving them unmatched image quality in industrial imaging applications such as semiconductor and wafer inspection, electronics and robotics inspection, and postal and parcel inspection. 
